In this article, we explore the world of precision machining of advanced ceramics, focusing on the various methods and techniques used in this field.
Machining in ceramic precision machining involves the use of grinding tools and abrasives to remove a very thin layer from the surface of a workpiece. This process is finer than conventional grinding and can achieve high shape accuracy and low surface roughness. Ceramic grinding can be divided into different forms such as surface grinding, internal grinding, external grinding, and centerless grinding.
When the grinding parameters are properly selected, a shape accuracy of 1 μm/m and a surface roughness of Ra<0.3 μm can be achieved. Batch light machining is similar to grinding in that it also utilizes free abrasives to produce a micro-removal effect on the surface material being machined, resulting in ultra-precise results. On the other hand, polishing plays a vital role in the precision machining of ceramic materials, especially in the production of ceramic balls used in ceramic bearings.
Optical glass, sapphire, alumina, silicon nitride and other ceramic materials, as well as semiconductor materials such as silicon wafers and GaAs substrates, often need to be polished. This process helps to improve the overall surface quality and plays a key role in achieving the required machining accuracy.
A noteworthy technology in advanced ceramic processing technology is ELID ultra-precision grinding. On-line electrolytic dressing (ELID) grinding, proposed by Omori et al. in 1987. The “Diamond Precision Grinding Technology” proposed by the Japan Institute of Physical Chemistry is a grinding process that utilizes diamond precision grinding technology. This technique has proven to be very effective for obtaining precise results in ceramic machining.
The theory of microremoval is the basis of the grinding and polishing process and can be explained by the microcutting action of the abrasive tip to remove surface defects. Polishing is usually done using diamond paste and cloth wheel polishers, utilizing this mechanism to achieve the desired result.
However, it is critical to consider the toughness of the material being machined when determining the material removal rate during machining and polishing. It was observed that higher toughness leads to lower processing efficiency. Therefore, it is necessary to optimize parameters to strike a balance between material removal and processing efficiency.
In conclusion, advanced ceramic processing technology has revolutionized the precision machining of ceramics. Through various techniques such as grinding, batch photomachining and polishing, manufacturers can achieve superior form accuracy and surface finish in their ceramic components. In addition, the application of ELID ultra-precision grinding technology further improves the precision and accuracy of ceramic processing. By knowing precise parameters and material properties, manufacturers can maximize ceramic processing efficiency and produce high-quality ceramic components for a variety of applications.
Post time: Aug-25-2023