Silicon Nitride Ceramic blocks, tiles, plates, etc
Features
►High strength: Bending strength is about twice that of AL2O3 and ALN substrates.
►High thermal conductivity: It is more than 3 times higher than AL2O3 substrate.
►Light and thin: its thickness can reach 1/2 of AlN substrate
►Excellent thermal shock resistance: its thermal expansion coefficient is close to that of silicon.
Item |
Unit |
Al2O3 |
AIN |
Si3N4 |
|
Density |
g/cm2 |
3.75 |
3.3 |
3.22 |
|
Thickness |
mm |
0.3175~1.0 |
0.4~2.5 |
0.238~0.635 |
|
Surface roughness level (Ra) |
μm |
0.4 |
0.2 |
0.4 |
|
Mechanical properties |
bending strength |
Mpa |
310~400 |
300~450 |
650 |
Young's modulus |
Gpa |
330 |
320 |
310 |
|
Vickers hardness |
Gpa |
14 |
11 |
15 |
|
fracture toughness |
Mpa.ml/2 |
3~4 |
2~4 |
5~7 |
|
Thermal expansion coefficient |
10 -6/K |
7.1~8.1 |
4.5~4.6 |
2.6 |
|
Thermal conductivity |
W/(m.K) |
20~30 |
160~255 |
60~120 |
|
Specific heat |
J/(kg/K) |
750 |
720 |
680 |
|
Electrical characteristics |
Dielectric constant |
/ |
9~10 |
8~9 |
7~9 |
Dielectric loss tangent |
...10-3 |
0.2 |
0.3 |
0.4 |
|
Volume resistivity |
Ω.m |
>1012 |
>1012 |
>1012 |
|
Breakdown voltage |
kv/mm |
>12 |
>14 |
>14 |